Crack pattern in ceramics subject to thermal shock

Patent pending

M. Z. Zubaer, H. Chun-Jen, K. Bhattacharya, G. Ravichandran, and I are pursuing a patent for the method for measuring, computing, and optimizing the fracture toughness in heterogeneous materials from (Hossain, Hsueh, Bourdin, & Bhattacharya, 2014).

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